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P.C.B. Specifications

1. Reference ............ index
2. Technology ........... simple layer double layer 4 layers 6 layers 8 layers 10 layers 12 layers 14 layers 16 layers 18 layers 20 layers holes non metallized metallized mixed blind
3. Class ................ class 1 class 2 class 3 class 4 class 5 class 6
4. Dimensions ........... x mm
5. Material ............. FR4 HTG Polyimide Verre-teflon Cyanate ester Kapton
6. Ended PCB thickness .. 0.4 0.8 1.2 1.6 2 2.4 3.2 mm
7. Cu thickness ......... 9 12 18 35 70 105 µm
8. Coating .............. SnPb H.A.S.L.
9. Gilding .............. without partial total connectors
10. Varnishes ............ 0 layer 1 layers 2 identical layers 2 different layers
11. Serigraph ............ 0 layer 1 layers 2 layers
12. Test ................. yes no cms sides : 0 1 2
13. Cutting .............. simple specific pre-cutting milling pre-cutting groving pre-cutting mill/groving.
14. Quantity .............
15. Delay ................ open days

Tooling

1. Layers files ......... gerber DPF HPGL DXF autre
2. Drilling files ....... Sieb&Meyer Excellon
3. Penalized ............ no yes
4. Solder paste gerber .. 0 film 1 film 2 films
5. Provide photos........ yes no